Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly started producing Apple’s A11 processor for the upcoming iPhone 7s, iPhone 7s Plus and iPhone 8. The firm originally aimed to start assembling the chip in April, but production was delayed when it encountered a number of issues with the 10-nanometer FinFET manufacturing process.

“TSMC has begun 10nm chip production for Apple’s next-generation iPhone 8 series,” an anonymous source told DigiTimes on Thursday. “Production was once affected by issues involving stacking components in the backend integrated fan-out packaging process, but they have already been solved.”

This appears to corroborate reports suggesting that Apple has given its suppliers a strict deadline to prepare components for the iPhone 8, which, according to OnLeaks, may ship as soon as September. One report in particular claims that TSMC will commence mass production of the chip on June 10, delivering A11 processors in bulk to Foxconn for assembly by the second half of July.

However, renowned KGI analyst Ming-Chi Kuo recently predicted that full-scale production of the iPhone 8 won’t start until October or November, resulting in severe shortages for potential buyers. Many have speculated that this could be because Apple is struggling to merge a Touch ID sensor into the handset’s display.

The iPhone 8 should have a5.8-inch edge-to-edge OLED screen

Apart from a faster A11 processor, all three rumored iPhone models are expected to pack glass bodies and wireless charging. The flagship iPhone 8 is also said come with a slew of additional goodies, including a 5.8-inch edge-to-edge screen, 3D facial recognition technology and a vertically-positioned dual-lens camera system.