We’re only a few weeks from Apple’s anticipated iPhone event, but at the rate we’re going, we’ll know everything by the time the event happens. Benjamin Geskin this week took to Twitter to show an image of the iPhone 7s Plus’ logic board, which shows off an upgraded A11 chip.
The image is confirmed to be the 7s Plus’ due to the location of the screws—which is similar to the 7 Plus’ hole placement. The A11’s bottom placement pad seems to match the leaked image of the chip last week.
Also confirmed in the image is the inclusion of an Intel modem. The modem’s pad looks nearly identical to the last year’s iPhone, which featured Intel’s XMM7360 modem chip. At the bottom of the logic board is the timestamp “3217,” likely corresponding to the 32nd week of 2017.
This latest leak gets into the nitty gritty of the iPhone 7s Plus’ compartments, and its on a par of what is expected of the upgrades. Given this is an S model, Apple only upgrades the internals like the processor and camera. The A11 chip should provide a solid performance improvement over last year’s A10 Fusion chip.
We also expect the iPhone 7s and iPhone 7s Plus to feature all-glass design to make way for wireless charging.