New photos of what are believed to be leaked iPhone 7 components suggests the handset may keep its beloved 3.5mm headphone jack after all. The device could also get dual SIM card slots, allowing users to juggle two numbers at the same time.
Rock Fix, a smartphone repair shop based in Ganzhou, China, posted the picture above on Chinese micro-blogging network Weibo. It is claimed they are all genuine Apple components made for the upcoming iPhone 7 series.
In the bottom right corner, we can see a flex cable that marries the Lightning port and other pieces of the iPhone to its logic board. Alongside that Lightning port, there is clearly a headphone jack — which goes against reports that have claimed Apple is ditching it.
It is thought the Cupertino company wanted to take this step to make the iPhone thinner. However, we know this year’s upgrade will be very similar in design to last year’s — and could even be ever so slightly thicker.
This could indicate that Apple is saving this move for next year’s iPhone upgrade, which is expected to be much more significant. Reliable KGI Securities analyst Ming-Chi Kuo expects the device to come with a complete redesign made almost entirely out of glass.
Another interesting component leaked by Rock Fix is the dual SIM card slot. This suggests Apple might finally give us the ability to use two SIM cards inside the iPhone. This is a feature that is especially popular in emerging markets like China and India, where Apple is looking to grow.
It’s hard to tell if these components are indeed genuine, so it’s probably best to take them with a pinch of salt for now. We probably won’t know exactly what Apple’s plans are for the iPhone 7 until the device gets its official unveiling this fall.