Samsung is expected to unveil the Galaxy S7 in just a few months, but the company may be scrambling to solve a pretty big problem with the rumored flagship phone. A new report out of China claims the South Korean giant may need to include add a heat pipe to its internal design to avoid possible overheating issues.
A heat pipe essentially circulates fluid as it evaporates into vapor and then cools back down, dispersing the thermal energy created by your device in the process. Similar technology is already used on a larger scale to cool some desktop computers. A small handful of mobile devices have also adopted heating pipes, including the Xperia Z5 Premium, the OnePlus 2, Xiaomi’s Mi Note and the Lumia 950 XL.
All four of those smartphones also happen to pack a Snapdragon 810 chip, which many say is prone to overheating. As for the Galaxy S7, it’s expected to offer either a Snapdragon 820 or Samsung’s own Exynos 8890 chip depending on where you buy it. Qualcomm’s been quick to deny any issues with its new chip, but it sounds like the Galaxy-maker still isn’t taking any chances.
Adding a heat pipe isn’t a bad idea, even if the phone isn’t prone to overheating. On the off chance that it does run a little hot, this means the processor won’t need to slow down to compensate. That should keep performance even at all times.
The report notes that Samsung is still considering a number of different heat pipe shapes and styles, though it should have a final decision by the end of the year. We just hope this doesn’t end up delaying the Galaxy S7 from its expected launch in early 2016.