The Galaxy S7 is reportedly set to pack a Snapdragon 820 chip in the U.S. and China, but Samsung may be running into some issues with the Qualcomm chip. BusinessKorea reports that the South Korean company is rushing to fix an overheating issue in the new design.
Samsung is apparently prepping a patch for the Snapdragon 820, which it hopes to release before the end of the month. If that doesn’t work, it could add a “radiating pipe” to cut down on excess heat. Either way. Samsung may be running out of time before the launch of its Galaxy S7, which is rumored to arrive as early as January 2016.
Samsung’s interest in the Snapdragon 820 isn’t limited to its own smartphone though. The company also provides the new 14nm FinFET technology used to produce these new chips. That means that any issues with the processor could affect Samsung’s profits for the entire year.
The new chip promises faster processing and quicker charging. It’s expected to power the Galaxy S7 along with new devices from LG, HTC, Xiaomi and others starting in early 2016, though that may all depend on Samsung’s ability to fix this alleged overheating issue.
UPDATE: We have received a statement from Qualcomm on the matter:
The rumors circulating in the media regarding Snapdragon 820 performance are false. The Snapdragon 820 improves on all IP blocks and is fabricated in the second generation of the 14nm process technology. It is meeting all of our specifications, but more importantly, it is satisfying the thermal and performance specifications from our OEMs.