Qualcomm has been quick to deny any problems with its Snapdragon 810 processor in public, but behind the scenes the alleged issue may have already been solved. A new report out of China claims the chip is no longer overheating, though it may not ship in large numbers until mid-March.
According to a popular Chinese analyst going by the name Old Yao on Weibo, overheating was indeed the issue, though it’s apparently already been solved. The news comes from sources inside Taiwan Semiconductor Manufacturing Company (TSMC) where the chip is being manufactured. The analyst also notes that the Snapdragon 810 could ship even sooner than mid-March, depending on how quickly TSMC can move.
Thankfully, it looks like Qualcomm will be ready to release the Snapdragon 810 in bulk in time for the next crop of flagship Android phones. Still, any delay at all could give Samsung and its Exynos-powered Galaxy S6 an edge over the competition, while companies like LG and HTC may be forced to wait for the new chip.